The demands on the SMT-Production are going more and more in the direction of Zero-Fault-Quality. Therefore it is necessary to check and optimize the individual processes early. The application of the solder-paste is the first critical process, by which the quality of the PC-Board is decisively influenced. Too little solder-paste can lead to cold solder-connections or can cause so-called "hot spots", too much solder-paste can cause shorts. In the case of Reflow-soldering, the components can start to swim and lead to the so-called “grave-stone effect”.

The TR-7006 is a 3D-Solder-Paste Inspection System that can be used on-line. Apart from X-, Y-Print Offset the height and the volume of the applied solder-paste up to structures for 0201-components are analysed. The result is displayed as a graphical 3D-height-profile of the solder-paste over the complete PC-Board and can therefore be used for the immediate process optimization during application of the solder-paste.